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E. Woirgard: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. P. Guilbault, E. Woirgard, C. Zardini, D. Lambert
    Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1529-1533 [Journal]
  2. S. Azzopardi, E. Woirgard, J.-M. Vinassa, O. Briat, C. Zardini
    IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:9-11, pp:1901-1906 [Journal]
  3. A. Guédon-Gracia, E. Woirgard, C. Zardini
    Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:9-11, pp:1652-1657 [Journal]
  4. S. Azzopardi, A. Benmansour, M. Ishiko, E. Woirgard
    Assessment of the Trench IGBT reliability: low temperature experimental characterization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:9-11, pp:1700-1705 [Journal]
  5. W. Lajnef, J.-M. Vinassa, O. Briat, E. Woirgard
    Specification and use of pulsed current profiles for ultracapacitors power cycling. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:9-11, pp:1746-1749 [Journal]
  6. A. Benmansour, S. Azzopardi, J. C. Martin, E. Woirgard
    Failure mechanism of trench IGBT under short-circuit after turn-off. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:9-11, pp:1778-1783 [Journal]
  7. O. Briat, W. Lajnef, J.-M. Vinassa, E. Woirgard
    Power cycling tests for accelerated ageing of ultracapacitors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:9-11, pp:1445-1450 [Journal]

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