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Masazumi Amagai: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Masazumi Amagai
    Mechanical reliability in electronic packaging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:4-5, pp:607-627 [Journal]
  2. Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya
    Mechanical characterization of Sn-Ag-based lead-free solders. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:6, pp:951-966 [Journal]
  3. Youngbae Kim, Hiroshi Noguchi, Masazumi Amagai
    Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:459-466 [Journal]

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