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M. O. Alam: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. M. O. Alam, Y. C. Chan, K. C. Hung
    Reliability study of the electroless Ni-P layer against solder alloy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:7, pp:1065-1073 [Journal]
  2. M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam
    Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2031-2037 [Journal]
  3. J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu
    Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:8, pp:1303-1310 [Journal]
  4. C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu
    The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:625-633 [Journal]
  5. M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
    Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:3, pp:505-514 [Journal]
  6. Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu
    Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:2, pp:295-302 [Journal]

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