SCEAS

The SCEAS System

Search the dblp DataBase

Title:
Author:

M. O. Alam: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

M. O. Alam, Y. C. Chan, K. C. Hung
Reliability study of the electroless Ni-P layer against solder alloy. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2002, v:42, n:7, pp:1065-1073 [Journal]
M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2003, v:43, n:12, pp:2031-2037 [Journal]
J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2003, v:43, n:8, pp:1303-1310 [Journal]
C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2003, v:43, n:4, pp:625-633 [Journal]
M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2004, v:44, n:3, pp:505-514 [Journal]
Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2004, v:44, n:2, pp:295-302 [Journal]

Search in 0.002secs, Finished in 0.002secs

NOTICE1
System may not be available sometimes or not working properly, since it is still in development with continuous upgrades

NOTICE2
The rankings that are presented on this page should NOT be considered as formal since the citation info is incomplete in DBLP