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G. Lefranc:
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- G. Lefranc, T. Licht, G. Mitic
Properties of solders and their fatigue in power modules. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2002, v:42, n:9-11, pp:1641-1646 [Journal]
- N. Seliger, E. Wolfgang, G. Lefranc, H. Berg, T. Licht
Reliable power electronics for automotive applications. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2002, v:42, n:9-11, pp:1597-1604 [Journal]
- G. Coquery, G. Lefranc, T. Licht, R. Lallemand, N. Seliger, H. Berg
High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1871-1876 [Journal]
- G. Lefranc, B. Weiss, C. Klos, J. Dick, G. Khatibi, H. Berg
Aluminum bond-wire properties after 1 billion mechanical cycles. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:9-11, pp:1833-1838 [Journal]
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