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D. Y. Luk: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Y. C. Chan, D. Y. Luk
    Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1195-1204 [Journal]
  2. Y. C. Chan, D. Y. Luk
    Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:8, pp:1185-1194 [Journal]

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