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X. Q. Shi: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. X. Q. Shi, Z. P. Wang, J. P. Pickering
    A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1105-1115 [Journal]
  2. X. Q. Shi, H. L. J. Pang, X. R. Zhang
    Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:5, pp:841-852 [Journal]

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