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Johan Liu: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Li-Rong Zheng, Johan Liu
    System-on-package: a broad perspective from system design to technology development. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:8, pp:1339-1348 [Journal]
  2. Johan Liu
    Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:4, pp:681-683 [Journal]
  3. Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li, Johan Liu
    Study on thermomechanical reliability of a tunable light modulator. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:5, pp:779-785 [Journal]
  4. C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu
    Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:266-272 [Journal]

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