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G. Q. Zhang: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. G. Q. Zhang
    The challenges of virtual prototyping and qualification for future microelectronics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:9-11, pp:1777-1783 [Journal]
  2. W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi
    Prediction and verification of process induced warpage of electronic packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:765-774 [Journal]
  3. W. D. van Driel, M. A. J. van Gils, R. B. R. van Silfhout, G. Q. Zhang
    Prediction of Delamination Related IC & Packaging Reliability Problems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:9-11, pp:1633-1638 [Journal]
  4. R. L. J. M. Ubachs, O. van der Sluis, W. D. van Driel, G. Q. Zhang
    Multiscale modelling of multilayer substrates. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:9-11, pp:1472-1477 [Journal]
  5. W. D. van Driel, O. van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
    Reliability modelling for packages in flexible end-products. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:9-11, pp:1880-1885 [Journal]
  6. A. J. van Roosmalen, G. Q. Zhang
    Reliability challenges in the nanoelectronics era. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:9-11, pp:1403-1414 [Journal]
  7. C. Yuan, W. D. van Driel, R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang
    Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:9-11, pp:1679-1684 [Journal]
  8. M. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
    Analysis of Cu/low-k bond pad delamination by using a novel failure index. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:179-186 [Journal]
  9. H. J. L. Bressers, W. D. van Driel, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang
    Correlation between chemistry of polymer building blocks and microelectronics reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:290-294 [Journal]
  10. W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang
    Advanced structural similarity rules for the BGA package family. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:205-214 [Journal]
  11. A. Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
    Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:280-289 [Journal]
  12. D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
    Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:233-239 [Journal]
  13. V. Gonda, K. M. B. Jansen, L. J. Ernst, J. den Toonder, G. Q. Zhang
    Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:248-251 [Journal]
  14. C. van't Hof, K. M. B. Jansen, G. Wisse, L. J. Ernst, D. G. Yang, G. Q. Zhang, H. J. L. Bressers
    Novel shear tools for viscoelastic characterization of packaging polymers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:240-247 [Journal]
  15. D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
    Numerical modeling of warpage induced in QFN array molding process. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:310-318 [Journal]
  16. M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
    Virtual qualification of moisture induced failures of advanced packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:273-279 [Journal]
  17. G. Q. Zhang, K. K. Lai
    Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem. [Citation Graph (0, 0)][DBLP]
    European Journal of Operational Research, 2006, v:169, n:2, pp:413-425 [Journal]

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