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Yuko Sawada: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Yuko Sawada, Kozo Harada, Hirofumi Fujioka
    Study of package warp behavior for high-performance flip-chip BGA. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:3, pp:465-471 [Journal]

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