The SCEAS System
Navigation Menu
Introduction
Collection Based
Clustering
Ranking
Paper Based
Journals
Conferences
DB Status
Statistics
Search

Search the dblp DataBase

Title:
Author:
Daniel Yap: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong
    Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:7, pp:1117-1123 [Journal]
  2. Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong
    Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:741-749 [Journal]
  3. Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong
    Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:8, pp:1329-1338 [Journal]

Search in 0.001secs, Finished in 0.001secs
NOTICE1
System may not be available sometimes or not working properly, since it is still in development with continuous upgrades
NOTICE2
The rankings that are presented on this page should NOT be considered as formal since the citation info is incomplete in DBLP
 
Introduction Collection Based Clustering Ranking Paper Based Journals Conferences DB Status Statistics Search
System created by asidirop@csd.auth.gr [http://users.auth.gr/~asidirop/] © 2002
for Data Engineering Laboratory, Department of Informatics, Aristotle University © 2002