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W. D. van Driel: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]
Publications of Author
- W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi
Prediction and verification of process induced warpage of electronic packages. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2003, v:43, n:5, pp:765-774 [Journal] - W. D. van Driel, M. A. J. van Gils, R. B. R. van Silfhout, G. Q. Zhang
Prediction of Delamination Related IC & Packaging Reliability Problems. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2005, v:45, n:9-11, pp:1633-1638 [Journal] - R. L. J. M. Ubachs, O. van der Sluis, W. D. van Driel, G. Q. Zhang
Multiscale modelling of multilayer substrates. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:9-11, pp:1472-1477 [Journal] - W. D. van Driel, O. van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
Reliability modelling for packages in flexible end-products. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:9-11, pp:1880-1885 [Journal] - C. Yuan, W. D. van Driel, R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:9-11, pp:1679-1684 [Journal] - H. J. L. Bressers, W. D. van Driel, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang
Correlation between chemistry of polymer building blocks and microelectronics reliability. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:290-294 [Journal] - W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang
Advanced structural similarity rules for the BGA package family. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:205-214 [Journal] - A. Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:280-289 [Journal] - D. G. Yang, K. M. B. Jansen, L. J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:310-318 [Journal] - M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
Virtual qualification of moisture induced failures of advanced packages. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:273-279 [Journal] - J. W. C. de Vries, M. Y. Jansen, W. D. van Driel
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:444-449 [Journal]
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