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Petar Ratchev:
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Publications of Author
- Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, Eric Beyne
Direct gold and copper wires bonding on copper. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2003, v:43, n:6, pp:913-923 [Journal]
- Petar Ratchev, Serguei Stoukatch, Bart Swinnen
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2006, v:46, n:8, pp:1315-1325 [Journal]
- Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2007, v:47, n:2-3, pp:259-265 [Journal]
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