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K. Suganuma: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. K. S. Kim, S. H. Huh, K. Suganuma
    Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:2, pp:259-267 [Journal]
  2. M. Yamashita, K. Suganuma
    Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:7, pp:1113-1118 [Journal]
  3. M. Yamashita, K. Suganuma
    Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:850-858 [Journal]

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