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Cemal Basaran: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Hua Ye, Douglas C. Hopkins, Cemal Basaran
    Measurement of high electrical current density effects in solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2021-2029 [Journal]

  2. Strain energy change due to an atomic defect in solder alloy lattice. [Citation Graph (, )][DBLP]


  3. Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. [Citation Graph (, )][DBLP]


  4. Computational simulation of electromigration induced damage in copper interconnects. [Citation Graph (, )][DBLP]


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