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H. P. Chan: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So
    Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:5, pp:823-831 [Journal]
  2. M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan
    Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:3, pp:505-514 [Journal]
  3. C. K. Wong, H. Wong, M. Chan, C. W. Kok, H. P. Chan
    Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:12, pp:2056-2061 [Journal]

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