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Eric Pek: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong
    Impact life prediction modeling of TFBGA packages under board level drop test. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:7, pp:1131-1142 [Journal]
  2. Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
    Dynamic responses and solder joint reliability under board level drop test. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:2-3, pp:450-460 [Journal]

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