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Xiaowu Zhang: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
    Thermo-mechanical finite element analysis in a multichip build up substrate based package design. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:611-619 [Journal]
  2. Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao
    Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:7-8, pp:1215-1221 [Journal]

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