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Srinivasamurthy Sampath: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
    Thermo-mechanical finite element analysis in a multichip build up substrate based package design. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:611-619 [Journal]

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