Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2005, v:45, n:9-11, pp:1443-1448 [Journal]
Arijit Roy, Cher Ming Tan Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2006, v:46, n:9-11, pp:1652-1656 [Journal]
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