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M. H. Lin: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang
    Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:7-8, pp:1061-1078 [Journal]
  2. M. H. Lin, C. C. Lo
    A location-based incentive pricing scheme for tree-based relaying in multi-hop cellular networks. [Citation Graph (0, 0)][DBLP]
    Integrated Network Management, 2005, pp:339-352 [Conf]

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