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M. A. J. van Gils: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]
Publications of Author
- W. D. van Driel, M. A. J. van Gils, R. B. R. van Silfhout, G. Q. Zhang
Prediction of Delamination Related IC & Packaging Reliability Problems. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2005, v:45, n:9-11, pp:1633-1638 [Journal] - M. A. J. van Gils, O. van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
Analysis of Cu/low-k bond pad delamination by using a novel failure index. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:179-186 [Journal] - W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang
Advanced structural similarity rules for the BGA package family. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:205-214 [Journal] - M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, R. B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
Virtual qualification of moisture induced failures of advanced packages. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2007, v:47, n:2-3, pp:273-279 [Journal]
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