Search the dblp DataBase
Chang-Lin Yeh: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]
Publications of Author
- Chang-Lin Yeh, Yi-Shao Lai
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2005, v:45, n:2, pp:371-378 [Journal] - Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:2-4, pp:645-650 [Journal] - Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao
Evaluation of board-level reliability of electronic packages under consecutive drops. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:7, pp:1172-1182 [Journal] - Chang-Lin Yeh, Yi-Shao Lai
Transient fracturing of solder joints subjected to displacement-controlled impact loads. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:5-6, pp:885-895 [Journal] - Chang-Lin Yeh, Yi-Shao Lai
Support excitation scheme for transient analysis of JEDEC board-level drop test. [Citation Graph (0, 0)][DBLP]
Microelectronics Reliability, 2006, v:46, n:2-4, pp:626-636 [Journal]
Search in 0.001secs, Finished in 0.001secs
| NOTICE1 |
|---|
| System may not be available sometimes or not working properly, since it is still in development with continuous upgrades |
| NOTICE2 |
|---|
| The rankings that are presented on this page should NOT be considered as formal since the citation info is incomplete in DBLP |
for Data Engineering Laboratory, Department of Informatics, Aristotle University © 2002