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Tong Hong Wang: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Yi-Shao Lai, Tong Hong Wang
    Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:3-4, pp:575-582 [Journal]
  2. Yi-Shao Lai, Tong Hong Wang
    Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:1, pp:104-110 [Journal]
  3. Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen
    Cyclic bending reliability of wafer-level chip-scale packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2007, v:47, n:1, pp:111-117 [Journal]

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