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Dietmar Krüger: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel
    Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:5-6, pp:768-773 [Journal]

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