|
Search the dblp DataBase
Seung-Boo Jung:
[Publications]
[Author Rank by year]
[Co-authors]
[Prefers]
[Cites]
[Cited by]
Publications of Author
- Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2006, v:46, n:2-4, pp:535-542 [Journal]
- Jeong-Won Yoon, Seung-Boo Jung
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. [Citation Graph (0, 0)][DBLP] Microelectronics Reliability, 2006, v:46, n:5-6, pp:905-914 [Journal]
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package [Citation Graph (, )][DBLP]
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications [Citation Graph (, )][DBLP]
Search in 0.001secs, Finished in 0.001secs
|