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Helen Shi: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Hua Lu, Helen Shi, Ming Zhou
    Thermally induced deformation of solder joints in real packages: Measurement and analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:7, pp:1148-1159 [Journal]

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