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Xunqing Shi: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi
    Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:2-4, pp:432-439 [Journal]

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