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Yufeng Jin: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang
    Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:335-338 [Journal]
  2. Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong
    A Novel Wafer-Level Packaging Solution For Mems. [Citation Graph (0, 0)][DBLP]
    International Journal of Computational Engineering Science, 2003, v:4, n:2, pp:339-342 [Journal]

  3. Signal modulation schemes comparison in the telemetry unit for retinal prosthesis system. [Citation Graph (, )][DBLP]


  4. Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. [Citation Graph (, )][DBLP]


  5. Multi-category human motion recognition based on MEMS inertial sensing data. [Citation Graph (, )][DBLP]


  6. Extraocular image processing for retinal prosthesis based on DSP. [Citation Graph (, )][DBLP]


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