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Paul S. Ho: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. Krishnakumar Sundaresan, Paul S. Ho, Siavash Pourkamali, Farrokh Ayazi
    A two-chip, 4-MHz, microelectromechanical reference oscillator. [Citation Graph (0, 0)][DBLP]
    ISCAS (6), 2005, pp:5461-5464 [Conf]
  2. Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho
    Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:1, pp:27-34 [Journal]
  3. Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai
    Reliability issues for flip-chip packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:5, pp:719-737 [Journal]
  4. Guotao Wang, Paul S. Ho, Steven Groothuis
    Chip-packaging interaction: a critical concern for Cu/low k packaging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:7-8, pp:1079-1093 [Journal]

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