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K. S. Kim: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. K. S. Kim, Hiroyuki Kambara, Duk Shin, Makoto Sato, Yasuharu Koike
    Learning and control model of arm posture. [Citation Graph (0, 0)][DBLP]
    IAS, 2006, pp:938-945 [Conf]
  2. Sethuraman Panchanathan, Youngchoon Park, K. S. Kim, PanKoo Kim, Forouzan Golshani
    The Role of Color in Content Based Image Retrieval. [Citation Graph (0, 0)][DBLP]
    ICIP, 2000, pp:- [Conf]
  3. J. K. Choi, M. Choi, T. S. Chung, Y. S. Shin, K. S. Kim
    Overall Design Requirements of Broadband ATM Network. [Citation Graph (0, 0)][DBLP]
    INFOCOM, 1991, pp:352-357 [Conf]
  4. K. S. Kim, P. K. Kim, J. J. Song, Y. C. Park
    Analyzing blood cell image to distinguish its abnormalities (poster session). [Citation Graph (0, 0)][DBLP]
    ACM Multimedia, 2000, pp:395-397 [Conf]
  5. J.-H. Baek, B. H. Ryu, S.-K. Lim, K. S. Kim
    Mobility model and performance analysis for zone-based registration in CDMA mobile communication system. [Citation Graph (0, 0)][DBLP]
    Telecommunication Systems, 2000, v:14, n:1-4, pp:13-29 [Journal]
  6. K. S. Kim, C. H. Yu, N. H. Kim, N. K. Kim, H. J. Chang, E. G. Chang
    Isothermal aging characteristics of Sn-Pb micro solder bumps. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:757-763 [Journal]
  7. K. S. Kim, S. H. Huh, K. Suganuma
    Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:2, pp:259-267 [Journal]
  8. K. S. Kim, H. I. Kim, C. H. Yu, E. G. Chang
    Fatigue analysis of high-speed photodiode submodule by using FEM. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:1, pp:167-171 [Journal]
  9. K. S. Kim, K. W. Ryu, C. H. Yu, J. M. Kim
    The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:3-4, pp:647-655 [Journal]
  10. K. S. Kim, C. H. Yu, J. M. Yang
    Tin whisker formation of lead-free plated leadframes. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2006, v:46, n:7, pp:1080-1086 [Journal]

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