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T. Y. Lin: [Publications] [Author Rank by year] [Co-authors] [Prefers] [Cites] [Cited by]

Publications of Author

  1. T. Y. Lin
    Neighborhood systems and relational databases. [Citation Graph (0, 0)][DBLP]
    ACM Conference on Computer Science, 1988, pp:725- [Conf]
  2. Churn-Jung Liau, T. Y. Lin
    Reasoning about relational granulation in modal logics. [Citation Graph (0, 0)][DBLP]
    GrC, 2005, pp:530-534 [Conf]
  3. Priya Baliga, T. Y. Lin
    Kolmogorov complexity based automata modeling for intrusion detection. [Citation Graph (0, 0)][DBLP]
    GrC, 2005, pp:387-392 [Conf]
  4. Wesley W. Chu, T. Y. Lin
    Introduction. [Citation Graph (0, 0)][DBLP]
    Appl. Intell., 2005, v:22, n:1, pp:7- [Journal]
  5. T. Y. Lin, Vladik Kreinovich
    A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. [Citation Graph (0, 0)][DBLP]
    Reliable Computing, 2001, v:7, n:1, pp:71-72 [Journal]
  6. T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
    The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:3, pp:375-380 [Journal]
  7. T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
    Development of the green plastic encapsulation for high density wirebonded leaded packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:811-817 [Journal]
  8. T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
    Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:5, pp:803-809 [Journal]
  9. Y. F. Yao, T. Y. Lin, K. H. Chua
    Improving the deflection of wire bonds in stacked chip scale package (CSP). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2003, v:43, n:12, pp:2039-2045 [Journal]
  10. T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma
    The impact of moisture in mold compound preforms on the warpage of PBGA packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:603-609 [Journal]
  11. Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin
    New encapsulation development for fine pitch IC devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:7-8, pp:1222-1229 [Journal]
  12. Xiaohua Hu, T. Y. Lin, Il-Yeol Song, Illhoi Yoo, Min Song
    A semi-supervised efficient learning approach to extract biological relationships from web-based biomedical digital library. [Citation Graph (0, 0)][DBLP]
    Web Intelligence and Agent Systems, 2006, v:4, n:3, pp:327-339 [Journal]
  13. Jianchao Han, T. Y. Lin, Jiye Li, Nick Cercone
    Constructing Associative Classifiers from Decision Tables. [Citation Graph (0, 0)][DBLP]
    RSFDGrC, 2007, pp:305-313 [Conf]

  14. Granular Computing and Web Processing: Representing Documents in Polyhedron. [Citation Graph (, )][DBLP]


  15. Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot. [Citation Graph (, )][DBLP]


  16. Neuro-Fuzzy Model-Based CUSUM Method Application in Fault Detection on an Autonomous Vehicle. [Citation Graph (, )][DBLP]


  17. Matrix Theory for Tolerance Granular Computing. [Citation Graph (, )][DBLP]


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