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Publications of Author

1. T. Y. Lin
   Neighborhood systems and relational databases. [Citation Graph (0, 0)][DBLP]
   ACM Conference on Computer Science, 1988, pp:725- [Conf]
   
2. Churn-Jung Liau, T. Y. Lin
   Reasoning about relational granulation in modal logics. [Citation Graph (0, 0)][DBLP]
   GrC, 2005, pp:530-534 [Conf]
   
3. Priya Baliga, T. Y. Lin
   Kolmogorov complexity based automata modeling for intrusion detection. [Citation Graph (0, 0)][DBLP]
   GrC, 2005, pp:387-392 [Conf]
   
4. Wesley W. Chu, T. Y. Lin
   Introduction. [Citation Graph (0, 0)][DBLP]
   Appl. Intell., 2005, v:22, n:1, pp:7- [Journal]
   
5. T. Y. Lin, Vladik Kreinovich
   A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. [Citation Graph (0, 0)][DBLP]
   Reliable Computing, 2001, v:7, n:1, pp:71-72 [Journal]
   
6. T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
   The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2002, v:42, n:3, pp:375-380 [Journal]
   
7. T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
   Development of the green plastic encapsulation for high density wirebonded leaded packages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:5, pp:811-817 [Journal]
   
8. T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
   Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:5, pp:803-809 [Journal]
   
9. Y. F. Yao, T. Y. Lin, K. H. Chua
   Improving the deflection of wire bonds in stacked chip scale package (CSP). [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2003, v:43, n:12, pp:2039-2045 [Journal]
   
10. T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma
    The impact of moisture in mold compound preforms on the warpage of PBGA packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2004, v:44, n:4, pp:603-609 [Journal]
    
11. Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin
    New encapsulation development for fine pitch IC devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:7-8, pp:1222-1229 [Journal]
    
12. Xiaohua Hu, T. Y. Lin, Il-Yeol Song, Illhoi Yoo, Min Song
    A semi-supervised efficient learning approach to extract biological relationships from web-based biomedical digital library. [Citation Graph (0, 0)][DBLP]
    Web Intelligence and Agent Systems, 2006, v:4, n:3, pp:327-339 [Journal]
    
13. Jianchao Han, T. Y. Lin, Jiye Li, Nick Cercone
    Constructing Associative Classifiers from Decision Tables. [Citation Graph (0, 0)][DBLP]
    RSFDGrC, 2007, pp:305-313 [Conf]
    
14. 
    Granular Computing and Web Processing: Representing Documents in Polyhedron. [Citation Graph (, )][DBLP]
    
    
15. 
    Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot. [Citation Graph (, )][DBLP]
    
    
16. 
    Neuro-Fuzzy Model-Based CUSUM Method Application in Fault Detection on an Autonomous Vehicle. [Citation Graph (, )][DBLP]
    
    
17. 
    Matrix Theory for Tolerance Granular Computing. [Citation Graph (, )][DBLP]